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TRF3705
www.ti.com
SLWS223A – AUGUST 2011 – REVISED OCTOBER 2011
EVALUATION BOARD
Populated RoHS-compliant evaluation boards are available for testing the TRF3705 as a stand-alone device.
Contact your local TI representative for information on ordering these evaluation modules, or see the TRF3705
product folder on the TI website. In addition, the TRF3705 can be evaluated with the DAC348x (quad/dual 16-bit,
1.25GSPS) EVM driving the baseband inputs through a seamless interface at 0.25V common-mode voltage.
PCB Design Guidelines
The TRF3705 device is fitted with a ground slug on the back of the package that must be soldered to the printed
circuit board (PCB) ground with adequate ground vias to ensure a good thermal and electrical connection. The
recommended via pattern and ground pad dimensions are shown in Figure 77 . The recommended via diameter
is 10 mils (0.10 in or 0,25 mm). The ground pins of the device can be directly tied to the ground slug pad for a
low-inductance path to ground. Additional ground vias may be added if space allows.
? 0,254
2,45
0,508
1,16
Note:
Dimensions are in millimeters (mm).
Figure 77. PCB Ground Via Layout Guide
Decoupling capacitors at each of the supply pins are strongly recommended. The value of these capacitors
should be chosen to provide a low-impedance RF path to ground at the frequency of operation. Typically, the
value of these capacitors is approximately 10 pF or lower.
The device exhibits symmetry with respect to the quadrature input paths. It is recommended that the PCB layout
maintain this symmetry in order to ensure that the quadrature balance of the device is not impaired. The I/Q input
traces should be routed as differential pairs and the respective lengths all kept equal to each other. On the RF
traces, maintain proper trace widths to keep the characteristic impedance of the RF traces at a nominal 50 Ω .
Copyright ? 2011, Texas Instruments Incorporated
Product Folder Link(s): TRF3705
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